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okamoto wafer grinding machine


Efficient Thickener

Efficient Thickener Efficient Thickener

ner Used for Minerals/Ores Thickening Adding the flocculants to increased sedimentat…

Magnetic Drum

Magnetic Drum Magnetic Drum

feeding particle size (450~0mm), no classification before feeding; High strength an…

Magnetic Separator

Magnetic Separator Magnetic Separator

ic system is compounded of ferrite and permanent magnets; the average magnetic induc…

Grid Type Ball Mill

Grid Type Ball Mill Grid Type Ball Mill

ll Mill Used for Minerals/Ores Grinding Jack-up device, easy maintenance; The hydros…

Concentrating Table

Concentrating Table Concentrating Table

rge range of transverse slope adjustment (0~10°),adjustable stroke; Keep the stabl…

SF Flotation Cell

SF Flotation Cell SF Flotation Cell

ir suction volume, low power consumption; Long service life of wear parts Each tank …

KYF Air Inflation Flotation Cell

KYF Air Inflation Flotation Cell KYF Air Inflation Flotation Cell

ion Separation for Mineral Flotating Low energy consumption, 30-50% savable; Solid p…

Cylinder Energy-Saving Overflow Ball Mill

Cylinder Energy-Saving Overflow Ball Mill Cylinder Energy-Saving Overflow Ball Mill

ical Energy-saving Ball Mill applied for the Minerals Grinding The transmission mach…

Zinc Powder Displacement Device

Zinc Powder Displacement Device Zinc Powder Displacement Device

zinc powder feeder is a kind of zinc powder feeding machine newly developed by Xinh…

Autogenous Mill

Autogenous Mill Autogenous Mill

fy the crushing and grinding process; feeding particle size is 200-350mm, and after …

OKAMOTO - Hartwig - Hartwig, Inc

From precise tool-room applications to challenging high-production runs, Okamoto has the highest-quality grinding machines for more applications than any

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Polishing Grinding Manufacturers - Wafer Production Equipment

List of Polishing Grinding equipment manufacturers - showing solar wafer production equipment companies that make Wafer Production Equipment machines

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Jeffry Jose Reyes - open for opportunities - Semiconductor

Pioneer of Wafer Sort, Dicing and Back grind start up team in ATMEL Philippines of wafer probers, probe tester, back grinding machine and dicing saw machine Backgrind Equipments: DISCO Grinder DFG840, DFG841, Okamoto GNX

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Jipal Corporation

Okamoto Image Appellation NO Characteristic Download Back Grinder for 200mm Own Developed Downfeed Grinding + Index Wafer Transfer Mechanism

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Grinding Products - Okamoto Corporation

OKAMOTO CORPORATION, Semiconductor Equipment Division provides Sales Service for Wafer Back Grinder for Si-Ge-Altic-GaAs-SOI-Silica, Polisher, Pitch

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Used Okamoto GNX 300B Grinder - Incentru com -

Dec 23, 2014 Used Okamoto GNX 300B Grinder Category: Used Semiconductor Grinder for wafer wafer manufacturing Link: http:incentru compins36 This

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Okamoto Surface Grinder

63 products offers 63 okamoto surface grinder products About 55 of these SUMORE made vertical surface grinder machine SP2502 okamoto surface grinder US $1740 0-1790 0 Okamoto, SVG502II-8 wafer back grinder

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Semiconductor - Okamoto Corporation

Okamoto Corporation HOME Products Surface Saddle ManualLinear AutomaticACC- 618 Series ACC-DX Series ACC-SA Series CNCACC-818NC

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Okamoto VG-502MKII8 System - S3 Alliance

continuous in-feed grinding machine, designed to grind Okamoto VG-502MKII8 System Four wafer chucks on carousel allow for maximum throughput -

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Jipal Corporation SEMI ORG

JIPAL CORPORATION is a professional agent for packaging equipment materials headquartered in Okamoto:Wafer Back Grinder Polisher for thin wafer

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Okamoto - NCMT

Rotary table grinding machine with horizontal spindle Ø600 Ø800 Capacity Lapping Polishing Semicon Wafer Grinders Polishers Silicon Ingot Grinders

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MISUZU INDUSTRIES CORPORATION » Equipment

Surface grinding machine, OKAMOTO MACHINE TOOL WORKS, LTD PSG-64AN Surface Wafer attach machine, Takatori Corporation, SAM-8, SAM-8

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START - Okamoto

Rotary table grinding machine with horizontal spindle Ø600 Ø800 Capacity Lapping Polishing Semicon Wafer Grinders Polishers Silicon Ingot Grinders

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Semiconductor Equipment - Okamoto Singapore

The Semiconductor Equipment Division supplies systems for ultra-precision finishing categories including grinding, CMPpolishing, lapping and slicing Okamoto The local polishing unit removes subsurface damage for increased wafer die

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Okamoto GNX200 - Axus Technology

The Okamoto GNX 200 System fully automatic wafer grinder with down-feed grinding method and Robotics wafer handling The machine can grind

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Relation with the end product - Okamoto Machine Tool Works

Polishing machine machine for Wafer material manufacturers and Grinder for Okamoto can provide a large grinding and polishing equipment is the only one

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Lapping machines Sell and Repair Page 2 - Excell Technology

Lapping machines Loh Model: UFM Wafer GrindingLappingPolishing 15 Okamoto Grind X Single Point Diamond GrinderPolisher and Grooving

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Technology - Okamoto Singapore

Downfeed grinding technology + Index Wafer Transfer Awarded JSME in 1996 Grinding machines use an unique down feed grinding method to maintain a

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Diamond Backgrinding Wheels - SMART CUT technology

Used on backgrinding machines for thinning and flattening silicon wafers, Used on machines manufactured by Disco, Okamoto, Strasbaugh, and many others

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Okamoto Corporation Home

OKAMOTO CORPORATION, Semiconductor Equipment Division provides Sales Service for Wafer Back Grinder for Si-Ge-Altic-GaAs-SOI-Silica, Polisher, Pitch

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